Govt Approves 23 Chip Design Projects Under DLI Scheme to Boost Semiconductor Push

New Delhi, Aug 22, 2025 — The Ministry of Electronics and Information Technology (MeitY) has approved 23 chip design projects under the Design Linked Incentive (DLI) scheme, strengthening India’s semiconductor ecosystem by supporting domestic start-ups and MSMEs developing chips for sectors such as surveillance, energy, and industrial automation.

Alongside the approvals, the ministry has also granted 72 companies access to industry-grade Electronic Design Automation (EDA) tools to accelerate the design and development process.

Vervesemi Leads India’s Chip Innovation

Among the key firms to benefit is Vervesemi Microelectronics, a Bengaluru-based fabless semiconductor company founded in 2017. The firm focuses on designing integrated circuits (ICs) while outsourcing manufacturing to specialized foundries.

Vervesemi’s upcoming chip portfolio includes:

• ASIC for weighing scales and bridge sensors – Sampling by end-2025
• ASIC for smart energy meters – Sampling by end-2025
• BLDC controller ASIC for small motors (fans, appliances) – Sampling in 2026
• Motor-control ASICs for EVs, drones, and automation – 2026
• Data acquisition ASICs for aerospace and avionics – 2026

“These innovations mark a turning point for India’s semiconductor ecosystem,” said Rakesh Malik, Founder & CEO of Vervesemi, emphasizing the company’s goal to drive import substitution and establish India as a global leader in chip design.

India’s Growing Semiconductor Mission

This development aligns with the Centre’s broader semiconductor mission, which focuses on both production and design. Earlier this month, the Union Cabinet cleared four additional semiconductor manufacturing projects, including two in Odisha and one each in Andhra Pradesh and Punjab.

With these initiatives, 10 semiconductor projects worth ₹1.6 trillion are now in progress across six states, aiming to generate thousands of direct and indirect jobs in the coming years.

The newly approved units include proposals from SiCSem, Continental Device India Pvt. Ltd (CDIL), 3D Glass Solutions Inc, and Advanced System in Package (ASIP) Technologies, involving a combined investment of around ₹4,600 crore and over 2,000 direct skilled jobs.